在半導(dǎo)體濕法工藝領(lǐng)域,精度和效率至關(guān)重要。CPH-P38-180/220-15-A T200 N2 加熱器專為清潔后干燥任務(wù)而設(shè)計,可替代熱系統(tǒng)中的傳統(tǒng)浸入式加熱器和加熱器包裹管,有效降低系統(tǒng)成本和復(fù)雜性。此加熱器以高功率密度優(yōu)勢專為峰值系統(tǒng)性能設(shè)計,確保最佳效率和快速響應(yīng)時間。其功率調(diào)節(jié)模塊便于調(diào)節(jié)出風口溫度,可高達200°C,通過先進印刷技術(shù)實現(xiàn)均勻熱傳遞,是晶圓快速干燥和旋轉(zhuǎn)IPA干燥工藝的理想選擇。
Precision and efficiency are critical in semiconductor wet processing. The CPH-P38-180/220-15-A T200 N2 heater, engineered for post-cleaning drying and reducing costs and complexity in thermal system. Its high power density ensures optimal efficiency and quick response. The adjustable power module controls outlet temperatures up to 200°C, and advanced printing technology achieves uniform heat distribution. Ideal for rapid wafer drying and rotary IPA processes.
1. **先進加熱技術(shù)**:
- 采用最先進的加熱管,實現(xiàn)快速高效的加熱。
2. **增強的安全功能**:
- 通過過熱保護探頭和 K 型熱電偶增強安全性(建議保護值設(shè)置為 200°C)。 具有保護管、螺紋導(dǎo)向通道和雙支撐底座,可確保安全安裝。
3. **精密控制系統(tǒng)**:
- 燃氣壓力調(diào)節(jié)器、節(jié)流閥、流量計、燃氣流量監(jiān)測、過溫保護檢測、出口溫度檢測、負載輸出和溫控功率調(diào)制模塊,實現(xiàn)精確、方便的控制。
1. **Advanced Heating Technology**:
- Utilizes state-of-the-art heating tubes for rapid and efficient heating.
2. **Enhanced Safety Features**:
- Enhanced safety with overheat protection probes and K-type thermocouples (recommended protection value set at 200°C). Features protective tubes, threaded guide channels, and a dual-support base for safe installation.
3. **Precision Control System**:
- Gas pressure regulators, throttle valves, flow meters, gas flow monitoring, over-temperature protection detection, outlet temperature detection, load output, and temperature control power modulation module for precise, accessible control.
化學氣相沉積(CVD):在CVD過程中,氮氣加熱器用于維持反應(yīng)腔室的溫度,確?;瘜W反應(yīng)的均勻性和效率。
物理氣相沉積(PVD):PVD過程中,氮氣加熱器幫助控制沉積環(huán)境的溫度,對薄膜的質(zhì)量和一致性至關(guān)重要。
快速熱處理(RTP):在RTP中,氮氣加熱器能夠提供快速而均勻的加熱,對提高晶圓表面質(zhì)量和微結(jié)構(gòu)的控制至關(guān)重要。
退火過程:在晶圓退火步驟中,氮氣加熱器用于提供控制的熱環(huán)境,有助于改善材料特性和電子性能。
清洗和干燥:在清洗晶圓后,氮氣加熱器可以用于干燥過程,以防止水痕和污染。
光刻后烘烤:光刻步驟后,使用氮氣加熱器進行烘烤,以固化光刻膠,提高圖案的精確度。
晶圓快速干燥:通過氮氣流快速吹掃晶圓表面,快速干燥減少水分造成的污染或晶圓表面的損傷。
旋轉(zhuǎn)IPA干燥工藝:晶圓在IPA蒸汽中旋轉(zhuǎn),使用加熱過的氮氣流吹掃,以去除IPA和水分,從而實現(xiàn)干燥。這種方法特別適用于去除最后的水痕,并且可以提供非常干凈、無殘留物的干燥表面。
備注:氮氣加熱器的應(yīng)用不僅局限于半導(dǎo)體行業(yè),還廣泛用于汽車制造(涂裝、干燥和熱處理),醫(yī)藥生產(chǎn)(藥品制造中的干燥、殺菌和熱處理),塑料和聚合物加工(高潔凈塑料成型、擠出和復(fù)合材料加工),以及實驗室和科研領(lǐng)域的精密溫度控制。
Chemical Vapor Deposition (CVD): In the CVD process, maintain the temperature of the reaction chamber, ensuring uniformity and efficiency of the chemical reactions.
Physical Vapor Deposition (PVD): During the PVD process, help control the temperature of the deposition environment, crucial for the quality and consistency of the film.
Rapid Thermal Processing (RTP): In RTP, provide rapid and uniform heating, critical for enhancing the quality and microstructure of the wafer surface.
Annealing Process: In the wafer annealing step, offer a controlled thermal environment, aiding in the improvement of material properties and electronic performance.
Cleaning and Drying: Post-wafer cleaning, nitrogen heaters are used in the drying process to prevent watermarks and contamination.
Post-Lithography Baking: After the lithography step, use for baking, solidifying the photoresist and improving pattern precision.
Rapid Wafer Drying: Rapidly dries wafers by blowing nitrogen gas over the surface, minimizing contamination or damage due to moisture.
Rotary IPA Drying Process: Wafers are rotated in IPA vapor, and heated nitrogen gas is blown to remove IPA and moisture, achieving a clean, residue-free dry surface. This method is particularly suitable for removing the last traces of water and providing a very clean, residue-free dry surface.
Remarks:Nitrogen heaters can be used in many situations including automotive manufacturing (coating, drying, heat treatment), pharmaceutical production (drying, sterilization, heat processing), plastics and polymer processing (molding, extrusion, composite fabrication), and for precision temperature control in laboratories and research.
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